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url: /en/docs/xt-c-485-hia-v3_5/specs/index.md
---
# Specifications

> This page is a summary. **The full parameter table — with a stage-by-stage description of the protection chain and the component choices — is on the [product page](/en/products/xt-c-485-hia-v3_5/).**

## Basic Parameters

| Parameter | Specification |
|------|------|
| Model | XT-C-485-HIA-V3/5 |
| Isolated transceiver | TDA51S485HC (isolated supply + isolated signal, SOIC-16W) |
| Supply voltage | 3.0 – 5.5 V (3.3 V / 5 V typical) |
| Supply current | 27.9 mA @ 3.31 V; 22.7 mA @ 5.01 V |
| Communication mode | RS-485 half-duplex, automatic direction control (no DE/RE signal needed) |
| Max data rate | 500 kbps |
| Bus load | 256 nodes (1/8 unit load) |
| Operating temperature | −40 ~ +125 °C |
| Dimensions | 90 × 20 mm |
| Board thickness | 1.6 mm |

## Mounting: SMD or Through-Hole

Every pad carries both features, so one board supports both mounting styles:

| Feature | Position | Purpose |
|------|------|------|
| **Castellated half-hole** (stamp hole) | Cut at the board edge | For **SMD reflow**: the module sits flat on your main board like an ordinary SMD part |
| **Full plated through-hole** | Hole centre inside the board | For **through-hole**: insert a 2.54 mm pin header or a 5.08 mm terminal when you prefer not to reflow |

> The two mounting styles are electrically equivalent — pick whichever suits your production line.

## Interfaces

| Side | Pins | Pitch |
|----|------|------|
| Logic side | `VIN` / `RX` / `TX` / `GND` | 2.54 mm |
| Bus side | `B` / `PE` / `A` | 5.08 mm |